IEC 61190-1-3:2010 pdf – Attachment materials for electronic assembly- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

IEC 61190-1-3:2010 pdf – Attachment materials for electronic assembly- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications. 5.2.2 Variation B alloys In alloys which are identified with a B suffix,...