IEC PAS 62326-20:2011 pdf – Printed boards – Part 20: Electronic circuit board for high-brightness LEDs
IEC PAS 62326-20:2011 pdf – Printed boards – Part 20: Electronic circuit board for high-brightness LEDs.
7 Marking, packaging and storage
7.1 Marking on a product
Marking on a product shall be agreed between user and supplier. The marking should include the following items
1) Name 01 the product and/or lot number
2) Producer or its code
3) Date of production
7.2 MarkIng on the package
Marking on a product shall be agreed between user and supplier. The marking should include the following items.
1) Name ol the product and/or lot number
2) Number ot products in a package
3) Date of production
4) Producer or its code
7.3 Packaging and storage
Packaging of a product should protect the product damages such as scratched, and also should protect from moisture.
Storage of PWB shall be stored in a place where damage from moisture can be protected.
8 NormatIve references
The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies.
JPCA-TDOI, Terms and definitions for printed circuits
JIS C 5603. Terms and definitions for printed circuits
JIS C 5012:1993. Test methods for printed wiring boards
The remarks stated here are for the explanation purpose of the standard only and not a part of the specifications themselves.
A.1 History of the development of this standard Procedure of the preparation of this PAS
C02 reduction is one of the most serious environmental issues. LED5 are of high interest In illumination for their high efficiency of nearly ten times and long life compared to incandescent lamps. Incandescent lamps are being switched recently to LEDs very rapidly In public facilities, offices, homes, automobiles and any possible places. Standardization especially for thermal management of substrates used for LED installation is a keen interest of the industry for further applications of LEDs of high luminance and high power in lighting applications.
JPCA has organized the Standardization Committee of Electronic Circuit Board for HighBrightness LEDs with Chair of Prof. Suzuki of Yamaguchi-Tokyo University of Science and had its first meeting in December 2, 2009. 65 members from 62 companies loined the Committee in areas of design, electronic circuit board, equipment, materials, metal plating and users. It was confirmed at the first meeting the necessity of preparing standard documents not only In Japan but to prepare international documents by submitting drafts to IEC as to the industry around world would be encouraged to develop the technology. It was also proposed to submit documents prepared by JPCA to IEC TC91 — Electronics Assembly Technology — as PASS (publicly available standard) as official IEC documents by means of D-liaison relations of JPCA with lEG TC91 for publicalion of documents within three months after submission II approved by the member countries of TC91. The committee drafted two documents. JPCA-TMC-LEDOIS Electronic circuil board for high-brightness LEDs” and JPCA-TMC-LEDO2T Test methods for electronic circuit board for high.brlghtnoss LEDs. The present will be submitted to IEC TC9I as a PAS and also as an NP (new work proposal) as an international standard.
k2 Additional information of some items of this document
This document has been prepared referring to the existing JPCA standard I or resin type boards, JPCAPB02•2O10 — printed wiring board, adding necessary items for property of substrates used for high-brightness LED5.
2) Classification and Class of the ECB
The ECB specified In this standard is classified using thermal conductivity and heat transfer coefficient in Table I based on actual evaluation results. It was confirmed that the classification suited the real application.
In case ot thermal conductive parameter, resin type substrate is classified below I WI(mK) or more than 1W/(mK) depend on with or without thermal via and its thermal conductivity of substrate.
In case of heat transfer coefficient parameter, resin type substrate is classified below 10
W/(m2K) and ceramic type and aluminum type substrate is classified more than 10 W/(m2K).