IEC 61190-1-3:2010 pdf – Attachment materials for electronic assembly- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
IEC 61190-1-3:2010 pdf – Attachment materials for electronic assembly- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications.
5.2.2 Variation B alloys
In alloys which are identified with a B suffix, the percentage by mass of antimony as an
impurity element shall not exceed 0.20.
5.2.3 Variation C alloys
In alloys which are identified with a C” suffix, the percentage by mass of antimony as an impurity element shall not exceed 0.05.
5.2.4 Variation D alloys
Alloys identified with a IT suffix are ultra-pure alloys that are intended for use in barrier- free die attachment applications. In alloys identified with a suffix, the combined total percentage by mass of all impurity elements shall not exceed 0.05 and the combined total percentage by mass of each of the lollowing sets of Impurity elements shall not exceed
Set 1: Be, Hg, Mg. and Zn. Set 2: As, Bi, P. and Sb.
5.3 Solder forms
This standard covers solders in the form of bars, wires, ribbons, and powders, and special solders. Normally bar solders and solder powder are not fluxed, and wire, ribbon, and special solders may be non-fluxed, flux-cored, flux-coated, or both flux-cored and flux’ coated. Users should determine from prospective sources the standard solder form characteristics that are available and should specify standard characteristics to the maximum extent feasible.
53.1 Bar solder
The nominal cross-section area, the nominal len9th, and the nominal mass shall be as specified (see Clause A.2 C)). Unless otherwise specified (see Clause A.2 dfl. the actual cross-section area shall not vary from the nominal value by more than 50 %, the actual length shall not vary from the nominal value by more than 20 %. and the actual mass shall not vary from the nominal value by more than 10 %. Bars with special end configurations, such as hooks or eyes, are classified as special solders.
5.3.2 Wire solder
The wire size, flux type. and flux percentage shall be as specified (see Clause A.2 e)). Unless otherwise specified (see Clause A.21)), wire solders shall have a circular crosssection, the wire size shall indicate the nominal outside diameter 01 the wire and the actual outside diameter shall not vary from the nominal diameter by more than 5 % or ±0.05 mm. whichever is greater.
5.3.3 Ribbon solder
The riboon thickness ano wiatn, flux type, ana flux percentage shall be as specified (see Clause A.2 g)). Unless otherwise specified (see Clause A.2 h)), ribbon solders shall have a rectangular cross-section, and the actual thickness and width shall not vary from their nominal values by more than ±5 % or ±0.05 mm, whichever is greater.
5.3.4 Solder powder
The powoer size and shape shall be as specified (see Clauses A.2 i)) and A.2 J)J. The characteristics of six standard solder powders. sizes 1 through 6, are listed In Table 4. When shape Is not specified, solder powder shall be spherical.
188.8.131.52 Powder size
Maximum particle size shall be determined in accordance with IEC 61189-6, Test method 6X04. Powder particle size distribution shall be determined in accordance with IEC 61189-6, Test methods 6X01, 6X02 or 6X03.
184.108.40.206 Powder shape
Solder powder shape shall be determined by visual observation using a binocular microscope with sufficient magnification, by the light beam scatter method, or by a suitable microscopic imaging analysis method. Solder powders visually determined to have at least 90 % of the particles with a length to width ratio of 1:2 or less shall be classified as spherical powders. Solder powders having a light beam scatter deviation result or an image analysis result that is equivalent to the above visual results shall be classified as spherical powders. All other powders shall be classified as non-spherical.
5.3.5 Special solder
All pertinent characteristics and tolerances for special form solders shall be specified (see Clause A.2 k)). Special solders include all solders which do not lully conform to another solder classification identif led herein or in IEC 61190-1-2. Special solders include, but are not necessarily limited to, anodes, bars with hook or eye ends, chips. ingots, multiple-alloy powders, pellets, preforms, rings, sleeves. etc.
5.4 Flux type and form
The flux type and form shall be as specified (see Clause A.2 I)). Fluxes used in the manufacture of solder products shall conform to the requirements of IEC 61190-1-1. Fluxes shall have been fully tested and characterized in accordance with IEC 61190-1-1, and shall have not been altered since being tested except for the addition of inert plasticizers.
5.4.1 Flux percentage
The percentage by mass of flux in/on solders shall be as specified (see Clause A,2 m)). For fluxed solders other than solder paste, the flux percentage is identified in accordance with Table 3, The flux percentage of flux-coated and/or flux’cored solder shall be determined in accordance with IEC 81189-6. Test method 6C09.